Kandou AI partners with our customers to revolutionize AI hardware systems leveraging four connectivity solutions:
We enable energy efficient GPU scale-up and scale-out connectivity with our next gen 448G and beyond copper links
We enable efficient scaling of memory subsystems for processors with our groundbreaking chip-to-chip links
We enable cost-effective networking solutions by extending the reach of copper links compared to conventional PAM based SerDes technologies
Our technology for Field Repairable Near Package Optics (NPO) improve thermal design, increase reliability and significantly reduce repair times for optical components.
All Kandou AI products are powered by our innovative and silicon proven wired Copper Multiple Input Multiple Output (MIMO) interconnect technology. We leverage this technology to deliver chiplet-based AI fabric solutions that enable our customers to build massively scalable AI systems with unprecedented reductions in expenditure.
Artificial Intelligence will transform every industry, just as electricity did in the last industrial revolution – but only if the cost of AI systems dramatically decreases.
At Kandou AI, our mission is to democratize AI by doing just that - delivering products that empower customers to build affordable, scalable, and energy-efficient AI systems worldwide.
More updates on Kandou AI will be coming soon. If you want to be ahead of the curve, get in touch with our sales team sales@kandou.ai