News Archives - Page 8 of 9 - Kandou

Category: News

  • Kandou’s Dr. Amin Shokrollahi to Speak about Chord™ Signaling at Design Automation Conference (DAC)

    Kandou’s Dr. Amin Shokrollahi to Speak about Chord™ Signaling at Design Automation Conference (DAC)

    Kandou Bus announced today that Dr. Amin Shokrollahi, Founder and CEO of Kandou, will speak at the 2018 Design Automation Conference (DAC) as part of the track entitled “Latest Developments in High Performance SoC Interface IP Standards.” Dr. Shokrollahi has been at the forefront of research in information communication for…

  • Glasswing IP and Moore’s Law

    Glasswing IP and Moore’s Law

    See Dr Shokrollahi’s LinkedIn post…

  • Kandou to Demonstrate 500 Gbit/s USR Glasswing PHY at DesignCon 2018

    Kandou to Demonstrate 500 Gbit/s USR Glasswing PHY at DesignCon 2018

    Santa Clara, January 24, 2018, Kandou Bus has announced that it will demonstrate its Glasswing™ USR SerDes technology at the DesignCon 2018 Conference, co-host a panel announcing a new industry consortium for developing USR solutions, and participate in an Optical Internetworking Forum (OIF) panel. “DesignCon is an excellent opportunity for…

  • Kandou Bus Applauds the OIF on Publication of CEI 4.0

    Kandou Bus Applauds the OIF on Publication of CEI 4.0

    The Optical Internetworking Forum (OIF) has published their CEI 4.0 Interoperability Agreement (IA) that contains a clause using Ensemble Non-Return-to-Zero (ENRZ) signaling, which was developed and first proposed by Kandou Bus. Kandou Bus CEO, Dr. Amin Shokrollahi said, > We are happy and proud that the OIF members saw fit to…

  • Ultra Low Latency FEC for Kandou Glasswing SerDes

    Ultra Low Latency FEC for Kandou Glasswing SerDes

    Very Low Power and Only 1.28ns Latency! Test and characterization of our test silicon for Glasswing is ongoing. As you may recall, Kandou’s Glasswing SerDes is optimized for die-to-die interconnect inside a shared MCM package. Total bandwidth is 500 Gbit/s of bidirectional throughput on 2.4 mm of die edge. Power…

  • Kandou Featured in September 11, 2017 Microprocessor Report

    Kandou Featured in September 11, 2017 Microprocessor Report

    Kandou’s 500 Gbit/s SerDes IP Targets 2.5D Kandou’s new 16 nm Glasswing hard macro enables 500 Gbit/s interfaces between die in a 2.5D package. The IP core implements the company’s unique protocol for 5-bit over 6-wire signaling. Download PDF…

  • Kandou Glasswing SerDes Early Test Results

    Kandou Glasswing SerDes Early Test Results

    Measure Power of 0.8pJ/bit! Testing of our Glasswing 16 nm test chip is proceeding very well. This IP will deliver 500 Gbit/s and is optimized for die-to-die interconnect inside a 150 um bump pitch MCM package. A few highlights of our testing include: TX and RX PLLs locking reliable at…

  • Kandou Glasswing Silicon Back from Foundry

    Kandou Glasswing Silicon Back from Foundry

    Open Eyes on All Channels! We just received our GW16-500-USR test silicon back from the foundry and have it up and running on test boards with open eyes on all channels! We are now working through debug and full test/char across all silicon corners. This IP is optimized for die-to-die…

  • Kandou was elected among the top 60 emerging companies to watch by EE Times

    Kandou was elected among the top 60 emerging companies to watch by EE Times

    Kandou was elected among the top 60 emerging companies to watch by EE Times, the online news outlet that covers everything that is important in the electronics industry.

  • Bessemer Venture Partners Invests $15 Million in Kandou

    Bessemer Venture Partners Invests $15 Million in Kandou

    Kandou Bus, S.A., the world’s highest performance and lowest energy SerDes technology company, has announced that it has completed a $15M investment with Bessemer Venture Partners. The resources will enable Kandou to expand research and accelerate the development, productization and deployment of Kandou’s Chord™ signaling SerDes technology. Kandou has developed…