Newly-Published JESD247 Specification is JEDEC’s First Standard for Multi-Wire, Multi-Level Chip-to-Chip SerDes Kandou Bus has announced that their Glasswing™ GW28-125-USR interface macro that has been manufactured, tested and characterized, is compliant to the newly published JEDEC specification, JESD247. Titled the “Multi-Wire, Multi-Level Interface Specification”, this new specification was published by…
LAUSANNE, SWITZERLAND (Marketwired – March 28, 2016) – Kandou Bus announced today that their Glasswing™ chip-to-chip link technology has been licensed by Marvell Technology Group for use in a variety of future multi-chip products. Based on Kandou’s CNRZ-5 Chord™ signaling architecture, Glasswing delivers high bandwidth signaling at very low power…
Kandou Bus announced today that David Stauffer of Kandou will speak at the OFC Market Watch session entitled OIF CEI 56G: Signal Integrity to the Forefront. Dr. Stauffer serves as the Chair of the Physical and Link Layer (PLL) Working Group of the Optical Internetworking Forum (OIF) and is a lead design…
Holden explained how the ENRZ electrical interface uses four wires to transmit three bits using the codes ±{+1, -1/3, -1/3, -1/3}. That is, any pair or wires can carry the +1 code and the other -1/3 codes travel between any other pairs of wires. At 37.3 Gbaud, ENRZ can deliver…
Attendees at ISSCC’s opening-night demonstration suites were privy to testing of a special long-reach SerDes developed by a Lausanne, Switzerland, startup offering new interface-signaling technologies. Kandou Bus will offer IP for use in everything from internal interposers to chip-to-chip interconnects. By employing correlated signals over a varying number of wires,…
We are excited for the industry to reflect how many different OIF IA projects are being applied to real-world products that are either available today or are being readied for deployment,” said Brian Holden of Kandou Bus and the OIF’s Marketing Education & Awareness Committee co-chair. “It is encouraging to…
Kandou Bus uses a novel form of spatial coding to transmit data between wired chips. The main idea is to introduce correlations between the signals sent on the interface, and choose the correlations judiciously to lower the power consumption, increase the speed, and lower the footprint. It is a generalization…
SAN FRANCISCO. — A math professor’s observation mushroomed into a startup with two demo chips and three standards efforts. Kandou Bus aims to drive a broad range of chip-to-chip and backplane interconnects down to picojoules/bit rates measured in single digits. Rick Merrit, EETimes…
Company Announces New Chord™ signaling technology at ISSCC that delivers 2-4X bandwidth improvement and half the power of conventional chip-to-chip links. SAN FRANCISCO, February 10, 2014 – Kandou Bus has announced that the first implementation of its breakthrough high-performance, low-power link technology will be introduced at the 2014 International Solid-State…
I also had the chance to catch up with Brian Holden, who can now say more about that secretive startup he had just joined when I saw him at Hot Chips last year. Kandou Bus is developing algorithms for three-wire interconnects it claims will enable new capabilities and efficiencies for…