The following resources are available to support your evaluation and development.
Outstanding design from day one
Kandou was founded by Mathematics professor Dr. Amin Shokrollahi and all our chip designs aspire to the perfection that is only possible through pure mathematics. A team of highly experienced wired signalling experts then put this theory into practice, ensuring we deliver the highly rigorous designs demanded by the world’s leading semiconductor manufacturers.
Tier 1 supply chain
The number one fabricator in the world – TSMC – are relied on by world-leading brands to deliver the highest manufacturing standards possible. We’ve been partnering with them for over a decade, utilising their expertise to take our fabrication well beyond industry standards.
Testing and rollout
Assembly and testing is taken care of by another world leader – ASECL Taiwan. Electrical tests are performed on all die, surpassing industry thresholds, before being assembled using the flip-chip CSP process to allow for the highest possible signal integrity. Finally, we go beyond standard industry specifications with parametrical and functional tests on every single packaged part, and perform random QA testing to make sure no defects of any kind are slipping through.
It just works
We undertake this process to make sure you have total peace of mind when you order a Kandou product. From initial installation and testing in your facility, to avoiding reliability issues in your products in years to come, our Tier 1 mindset goes beyond at every stage. It’s why we’ve shipped tens of millions of units to date – and why you’ll find our semiconductors everywhere from households to cockpits.
Best in class
lead times
Tens of millions
of units shipped to date
1,500
processing steps
ISO 9001
Certification across the entire range
Our Operations Team
Frank LavetyGeneral Manager
Graham DoakEngineering Operations Manager
Michael Dixon Business Operations Manager
Glasswing Resources
The following resources are available to support your evaluation and development.